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IEEE Transactions on Circuits and Systems II |
| TCAS-II EDITORIAL BOARD 2012-2013 |
EDITOR-IN-CHIEF
Yong Lian
Department of Electrical and Computer Engineering
National University of Singapore
4 Engineering Drive 3
Singapore 117576
DEPUTY EDITOR-IN-CHIEF
Mohamad Sawan
Ecole Polytechnique
University of Montreal
2900 Edouard-Montpetit, bureau M5418
Montreal Qc H3C3A7, Canada
EDITORIAL ASSISTANT
Chacko John Deepu
Department of Electrical and Computer Engineering
National University of Singapore
4 Engineering Drive 3
Singapore 117576
ASSOCIATE EDITORS
Albert Wang
Univ. of California at Riverside
Riverside, CA92521, USA
aw(at)ee.ucr.edu
Amine Bermak
Hong Kong University of Science and Technology
Kowloon, Hong Kong
eebermak(at)ust.hk
Andrea Bevilacqua
DEI - Universita di Padova
Padova, Italy
andrea.bevilacqua(at)dei.unipd.it
Bin-Da (Brian) Liu
National Cheng Kung University
Tainan 70101,Taiwan
bdliu(at)mail.ncku.edu.tw
Biranchinath Sahu
Texas Instruments (India) Pvt. Ltd
Bangalore - 560093, India
biranchinath_sahu(at)ti.com
Chen-Yi Lee
National Chiao Tung University
Taiwan
cylee(at)faculty.nctu.edu.tw
Edoardo Bonizzoni
Univeristy of Pavia
27100 Pavia, Italy
edoardo.bonizzoni(at)unipv.it
Fabio Pareschi
Universita di Ferrara
Ferrara, Italy
fabio.pareschi(at)unife.it
George Yuan
Hong Kong University of Science and Technology
Kowloon, Hong Kong
eeyuan(at)ust.hk
Giuseppe Grassi
Universita del Salento
73100 Lecce, Italy
giuseppe.grassi(at)unisalento.it
Guoxing Wang
Shanghai Jiao Tong University
Shanghai, China
wgxsjtu(at)gmail.com
Ha Yajun
National Unviersity of Singapore
Singapore
elehy(at)nus.edu.sg
Heng Cheng Huat
National Unviersity of Singapore
Singapore
elehch(at)nus.edu.sg
Herve Barthélemy
Université du Sud Toulon-Var
83957 La Garde Cedex, France
herve.barthelemy(at)univ-tln.fr
Hoi-Jun Yoo
KAIST
Daejeon, Korea
hjyoo(at)ee.kaist.ac.kr
Huazhong Yang
Tsinghua University,
Beijing, China
yanghz(at)tsinghua.edu.cn
Jinhu Lu
RMIT University
Melbourne, Australia
jinhu.lu(at)rmit.edu.au
Ke-Horng Chen
National Chiao Tung University
Hsinchu, Taiwan
khchen(at)faculty.nctu.edu.tw
Krishnendu Chakrabarty
Duke University
NC 27708, USA
krish(at)ee.duke.edu
Luis Hernandez Corporales
Universidad Carlos III de Madrid
Spain
luish(at)ing.uc3m.es
Mohammad Mansour
American University of Beirut
Beirut, Lebanon
mmansour(at)aub.edu.lb
Nagendra Krishnapura
IIT Madras
Chennai 600036, India
nagendra(at)iitm.ac.in
Oscar Gustafsson
Linköping University
Linköping, Sweden
oscarg(at)isy.liu.se
Peng Li
Texas A&M University,
TX 77843, USA
pli(at)neo.tamu.edu
Philip Mok
Hong Kong University of Science and Technology
Kowloon, Hong Kong
eemok(at)ece.ust.hk
Pieter Rombouts
Ghent University
Gent, Belgium
pieter.rombouts(at)elis.ugent.be
Pui-In Mak, Elvis
University of Macau,
Taipa, Macau SAR, China
PIMak(at)umac.mo
Rui Martins
University of Macau,
Taipa, Macau, China
rmartins(at)umac.mo
Salvatore Levantino
Politecnico di Milano
Milano 20133, Italy
levantin(at)elet.polimi.it, salvatore.levantino(at)gmail.com
Samuel Palermo
Texas A&M University
TX 77843, USA
spalermo(at)mail.ece.tamu.edu
Shing-Chow Chan
University of Hong Kong
Hong Kong
scchan(at)eee.hku.hk
Xicheng Jiang
Broadcom Corporation
Irvine, CA, USA
xicheng(at)broadcom.com
Tai-Cheng Lee
National Univerity of Taiwan
Taiwan
tlee(at)cc.ee.ntu.edu.tw
Tian-Bo Deng
Toho University
Chiba 274-8510, Japan
deng(at)is.sci.toho-u.ac.jp
Tom(Qiang) Li
Songpower Communications Corp.
Irvine, CA92617, USA
tom.li(at)song-power.com
Tong Tian
Shanghai Institute of Microsystem and Information Technology
Shanghai, China
tiantong(at)mail.sim.ac.cn
Tong Zhang
Rensselaer Polytechnic Institute (RPI)
NY 12180, USA
tzhang(at)ecse.rpi.edu
Wei Ping Zhu
Concordia University, EV005.225
Montreal, Quebec, Canada
weiping(at)ece.concordia.ca
Wing Hung Ki
Hong Kong University of Science and Technology
Kowloon, Hong Kong
eeki(at)ust.hk
Yajun Yu
Nanyang Technological University
Singapore
eleyuyj(at)pmail.ntu.edu.sg
Yao Libin
Kunming Institute of Physics
Kunming, China
libin.yao(at)gmail.com
Yoshifumi Nishio
Tokushima Univeristy
Tokushima 770-8506, Japan
nishio(at)ee.tokushima-u.ac.jp
Yoshikazu Miyanaga
Hokkaido University
Sapporo, Japan
miya(at)ist.hokudai.ac.jp
Zhihua Wang
Tsinghua University,
Beijing, China
zhihua(at)mail.tsinghua.edu.cn
Zhongfeng Wang
Broadcom Corp
CA, USA
zfwang(at)broadcom.com
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