EDITOR-IN-CHIEF

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Yong Lian

Department of Electrical and Computer Engineering

National University of Singapore

4 Engineering Drive 3

Singapore 117576

tcas2eic@nus.edu.sg

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DEPUTY EDITOR-IN-CHIEF

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Mohamad Sawan

Ecole Polytechnique

University of Montreal

2900 Edouard-Montpetit, bureau M5418

Montreal Qc H3C3A7, Canada

mohamad.sawan@polymtl.ca

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EDITORIAL ASSISTANT

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Chacko John Deepu

Department of Electrical and Computer Engineering

National University of Singapore

4 Engineering Drive 3

Singapore 117576

tcas2@nus.edu.sg

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ASSOCIATE EDITORS

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Alyssa B. Apsel

Cornell University Ithaca

NY 14850, USA

apsel(at)ece.cornell.edu

Angelo Brambilla

Politecnico di Milano

Milano, Italy

brambill(at)elet.polimi.it

Antonio Liscidini

University of Pavia

Pavia, Italy

antonio.liscidini(at)unipv.it

Bin-Da (Brian) Liu

National Cheng Kung University

Tainan 70101, Taiwan

bdliu(at)mail.ncku.edu.tw

Chen-Yi Lee

National Chiao Tung University

Taiwan

cylee(at)faculty.nctu.edu.tw

Chua-Chin Wang

National Sun Yat-Sen University

Kaohsiung, Taiwan

ccwang(at)ee.nsysu.edu.tw

Eric Kerherve

University of Bordeaux

Talence Cedex, France

eric.kerherve(at)ims-bordeaux.fr

Gabriel Rincon-Mora

Georgia Institute of Technology

Atlanta, GA 30308, USA

rincon-mora(at)gatech.edu

Gwee Bah Hwee

Nanyang Technological University

Singapore

ebhgwee(at)ntu.edu.sg

Herve Barthélemy

Université du Sud Toulon-Var

La Garde Cedex, France

herve.barthelemy(at)univ-tln.fr

Henry Chung

City University of Hong Kong

Hong Kong

eeshc(at)cityu.edu.hk

Hoi-Jun Yoo

Korea Advanced Institute Science and Technology (KAIST)

Daejeon, 305-701, Korea

hjyoo(at)ee.kaist.ac.kr

Huazhong Yang

Tsinghua University

Beijing, China

yanghz(at)tsinghua.edu.cn

Igor Belykh

Georgia State University

Atlanta, GA 30303-3083, USA

ibelykh(at)gsu.edu

Jeyanandh Paramesh

Carnegie Mellon University

Pittsburgh, PA 15213, USA

paramesh(at)ece.cmu.edu

Krishnendu Chakrabarty

Duke University

Durham, NC 27708, USA

krish(at)ee.duke.edu

Maysam Ghovanloo

Georgia Institute of Technology

Atlanta, GA 30308, USA

mghovan(at)ece.gatech.edu

Mohammad Mansour

American University of Beirut

Beirut 1107 2020, Lebanon

mmansour(at)aub.edu.lb

Nagendra Krishnapura

IIT

Madras Chennai, India

nagendra(at)iitm.ac.in

Oscar Gustafsson

Linköping University

Linköping, Sweden

oscarg(at)isy.liu.se

Pedram Mohseni

Case Western Reserve University

Cleveland, OH 44106-7071, USA

pedram.mohseni(at)case.edu

Peng Li

Texas A&M University

College Station, TX 77843, USA

pli(at)neo.tamu.edu

Pramod Kumar Meher

Institute for Infocomm Research

Singapore

pkmeher(at)i2r.a-star.edu.sg

Pui-In Mak, Elvis

University of Macau

Taipa, Macau SAR, China

PIMak(at)umac.mo

Roman Genov

University of Toronto

Toronto, Ontario M5S 3G4, Canada

roman(at)eecg.toronto.edu

Rui Martins

University of Macau

Taipa, Macau SAR, China

rmartins(at)umac.mo

Tong Zhang

Rensselaer Polytechnic Institute (RPI)

Troy, NY 12180, USA

tzhang(at)ecse.rpi.edu

Yajun Yu

Nanyang Technological University

Singapore

eleyuyj(at)pmail.ntu.edu.sg

Libin Yao

Kunming Institute of Physics

Kunming, China

yaolibin(at)knir.cn

Zhihua Wang

Tsinghua University

Beijing, China

zhihua(at)mail.tsinghua.edu.cn

Zhiping Lin

Nanyang Technological University

Singapore

EZPLin(at)ntu.edu.sg

Zhongfeng Wang

Broadcom Corporation

USA

zfwang(at)broadcom.com

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