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IEEE Transactions on Circuits and Systems II |
| Special Issues |
Multifunctional Circuits and Systems for Future Generations of Wireless Communications
New Submission (Hard Deadline) Deadline: August 14, 2007, 23:59:59 (GMT+2)
Circuits and Systems Solutions for Nanoscale CMOS Design Challenges (2008)
NEW Submission Deadline: October 29, 2008, 23:59:59 (GMT+2)
HIGH-PERFORMANCE MULTI-CHIP INTERCONNECTIONS (2009)
NEW Submission Deadline: October 30, 2009, 23:59:59 (GMT+2)
Authors should follow the same steps for submission as for regular papers, but during the submission process, please be sure to place the phrase "HIGH-PERFORMANCE MULTI-CHIP INTERCONNECTIONS" before the title of your manuscript whenever prompted on a web form, so that your paper is identifiable as a special issue submission.
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